BS EN 60068-2-69:2017+A1:2019
$198.66
Environmental testing – Tests. Test Te/Tc. Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method
| Published By | Publication Date | Number of Pages |
| BSI | 2019 | 60 |
This part of IEC 60068 outlines test Te/Tc, the solder bath wetting balance method and the solder globule wetting balance method to determine, quantitatively, the solderability of the terminations. Data obtained by these methods are not intended to be used as absolute quantitative data for pass–fail purposes.
The procedures describe the solder bath wetting balance method and the solder globule wetting balance method. They are applicable to components and printed boards with metallic terminations and metallized solder pads.
This document provides the measurement procedures for solder alloys both with and without lead (Pb).
PDF Catalog
| PDF Pages | PDF Title |
|---|---|
| 2 | National foreword |
| 5 | Blank Page |
| 7 | English CONTENTS |
| 10 | FOREWORD |
| 12 | 1 Scope 2 Normative references 3 Terms and definitions |
| 13 | 4 General description of the method 4.1 General 4.2 Components 4.3 Printed boards 4.4 Measurement 5 Description of the test apparatus |
| 14 | Figure 1 – Arrangement for the test apparatus (solder bath wetting balance method) Figure 2 – Arrangement for the test apparatus (solder globule wetting balance method) |
| 15 | 6 Preparation of specimens 6.1 Cleaning 6.2 Preconditioning Figures Tables Table 1 – Preconditioning |
| 16 | 7 Materials 7.1 Solder 7.1.1 General 7.1.2 Solder alloy containing lead 7.1.3 Lead-free solder alloy 7.1.4 Solder contamination control |
| 17 | 7.1.5 Solder mass for solder globule wetting balance method Table 2 – Maximum limits of solder bath contaminants Table 3 – Pin diameter and solder pellet mass |
| 18 | 7.2 Flux 7.2.1 Rosin based flux 7.2.2 Flux maintenance 7.2.3 Test flux selection criteria 8 Procedure 8.1 Test temperature 8.1.1 Solder alloy containing lead 8.1.2 Lead-free solder alloy 8.2 Test procedure 8.2.1 Applicable test procedure Table 4 – Rosin based flux compositions |
| 19 | 8.2.2 Solder bath wetting balance procedure |
| 20 | Table 5 – Recommended solder bath wetting balance test conditions |
| 21 | Figure 3 – Immersion conditions for solder bath method |
| 22 | 8.2.3 Solder globule wetting balance procedure Table 6 – Time sequence of the test (solder bath) |
| 23 | Table 7 – Recommended solder globule wetting balance test conditions |
| 24 | Figure 4 – Immersion conditions for solder globule method |
| 25 | 8.2.4 Procedure for testing printed board specimens Table 8 – Time sequence of the test (solder globule) |
| 26 | Figure 5 – Suggested wetting balance test specimens for printed boards |
| 27 | Figure 6 – Printed board immersion |
| 28 | 9 Presentation of results 9.1 Form of force versus time trace Figure 7 – Typical wetting balance trace |
| 29 | 9.2 Test requirements 10 Information to be given in the relevant specification |
| 30 | Annexes Annex A (normative) Equipment specification A.1 Characteristics of the apparatus A.2 Solder bath |
| 31 | A.3 Globule support blocks |
| 32 | Annex B (informative) Use of the wetting balance for SMD solderability testing B.1 Definition of the measure of solderability B.2 Gauge R&R – Test protocol for wetting balance gauge repeatability and reproducibility using copper foil coupons B.2.1 Test coupon |
| 33 | B.2.2 Test parameters B.2.3 Known good coupon |
| 34 | B.3 Solder pellet mass and pin diameter B.4 Specimen orientation and immersion depth B.4.1 General |
| 35 | B.4.2 Resistors and capacitors B.4.3 Small-leaded components B.4.4 Multi-leaded devices |
| 36 | B.5 Test flux Table B.1 – Carboxylic acid based flux (water solution) Table B.2 – Carboxylic acid based flux (alcohol solution) |
| 37 | B.6 Test temperature B.6.1 Solder alloy containing lead B.6.2 Solder alloy without lead B.7 Characteristics of the test apparatus B.7.1 Recording device |
| 38 | B.7.2 Balance system B.7.3 Lifting mechanism and controls |
| 41 | Figure B.1 – Understanding wetting curves |
| 42 | Figure B.2 – Typical wetting curve |
| 43 | B.7.4 Parameters to be measured from the force-time trace Figure B.3 – Representative force-time curves |
| 44 | B.7.5 Reference wetting force |
| 45 | B.7.6 Equipment location B.7.7 Globule pins B.7.8 Globule modules B.8 Test flux – IPC-J-STD-002/J-STD-003 activated solderability test flux rationale committee letter B.8.1 General B.8.2 Proactive solderability testing approach to the implementation of non-tin finishes |
| 46 | B.8.3 Reduced solderability test variability B.8.4 Standardization of solderability test flux composition on a global scale |
| 47 | Annex C (normative) Test methods for SMD components sizes 0603M (0201) or smaller C.1 General C.2 General description of the test method C.3 Preconditioning C.3.1 Preparation of the specimens C.3.2 Ageing C.4 Materials C.4.1 Solder |
| 48 | C.4.2 Flux C.5 Method 1 C.5.1 Description of the test apparatus C.5.2 Procedures Figure C.1 – Cross-section of aluminium body |
| 49 | Figure C.2 – Dipping position and relative position |
| 50 | Table C.1 – Time sequence of the test procedure |
| 51 | C.5.3 Presentation of results Figure C.3 – Time and test sequence |
| 52 | C.5.4 Information to be given in the relevant specification Figure C.4 – Typical wetting balance trace |
| 53 | C.6 Method 2 C.6.1 Test apparatus C.6.2 Observation equipment C.6.3 Test method 2 |
| 54 | C.6.4 Presentation of results |
| 55 | Annex D (informative) Evaluation criteria – Guidance D.1 General considerations D.2 Evaluation criteria for components Table D.1 – Wetting balance parameter and suggested evaluation criteria |
| 56 | D.3 Evaluation criteria for printed boards Figure D.1 – Set A wetting curve Figure D.2 – Set B wetting curve Table D.2 – Printed board test parameter and suggested criteria |
| 57 | Annex E (informative) Method of calculating the maximum theoretical force and integrated value of the area of the wetting curve for leaded non-SMD E.1 Method of calculating the maximum theoretical force E.2 Method of calculating the integrated value of the area of the wetting curve |
| 59 | Bibliography |
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