BS EN 60191-4:2014+A1:2018

$167.15

Mechanical standardization of semiconductor devices – Coding system and classification into forms of package outlines for semiconductor device packages

Published By	Publication Date	Number of Pages
BSI	2018	42

Guaranteed Safe Checkout

Categories: 31.080.01 - Semiconductor devices in general, BSI

If you have any questions, feel free to reach out to our online customer service team by clicking on the bottom right corner. We’re here to assist you 24/7.
Email:[email protected]

This part of IEC 60191 specifies a method for the designation of package outlines and for the classification of forms of package outlines for semiconductor devices and a systematic method for generating universal descriptive designators for semiconductor device packages.

The descriptive designator provides a useful communication tool but has no implied control for assuring package interchangeability.

PDF Catalog

PDF Pages	PDF Title
2	undefined
4	Untitled
5	English CONTENTS
6	FOREWORD
8	1 Scope 2 Coding system of package outlines for semiconductor devices 3 Classification into forms of package outlines for semiconductor devices
9	4 Coding system for semiconductor-device packages 4.1 General 4.2 New descriptive codes 4.3 Descriptive designators 4.3.1 General remarks 4.3.2 Minimum descriptive designator
10	Figures Figure 1 – Descriptive coding for semiconductor device packages
11	4.3.3 Terminal-position prefix 4.3.4 Package-body-material prefix Tables Table 1 – Package-outline-style codes
12	4.3.5 Package-specific feature prefix 4.3.6 Lead-form and terminal-count suffixes Table 2 – Terminal-position prefixes
13	Figure 2 – Relationship of codes to profile Table 3 – Prefixes for predominant package-body material Table 4 – Prefixes for package-specific features
14	4.3.7 Detailed information field
15	5 Coding system of package-outline styles Table 5 – Suffixes for lead form (or terminal shape)
18	Annex A (informative) Examples of descriptive coding system application
19	Table A.1 – Descriptive coding system application
20	Figure A.1 – Typical package styles and descriptive coding system (1 of 4)
24	Figure A.2 – Examples of lead forms (or terminal shapes)
25	Annex B (informative) Derivation and application of the descriptive coding system – Common package names Figure B.1 – Descriptive coding system for common name of semiconductor-device package
26	Table B.1 – Basic package code and names
27	Table B.2 – Common package name and descriptive code examples
28	Annex C (informative) Terminology of semiconductor package outlines
29	Table C.1 – Package name and parts name

Status

Definitive

Title

Mechanical standardization of semiconductor devices – Coding system and classification into forms of package outlines for semiconductor device packages

Replaces

BS EN 60191-4:2000

Publisher

BSI

Committee

EPL/47

Pages

Publication Date

2018-05-30

ISBN

978 0 580 95747 5

Standard Number