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BS EN IEC 60539-1:2023 – TC

BS EN IEC 60539-1:2023 – TC

$280.87

Tracked Changes. Directly heated negative temperature coefficient thermistors – Generic specification

Published By Publication Date Number of Pages
BSI 2023 194
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IEC 60539-1:2022 is applicable to directly heated negative temperature coefficient thermistors, typically made from transition metal oxide materials with semiconducting properties. It establishes standard terms, inspection procedures and methods of test for use in sectional and detail specifications of electronic components for quality assessment or any other purpose. This edition includes the following significant technical changes with respect to the previous edition:

  1. Restructured completely to comply to ISO/IEC directives; categorization and reorganization of test methods into these categories;
  2. Annex X added for comparison to the previous edition;
  3. Some wordings, figures and references have been revised.

PDF Catalog

PDF Pages PDF Title
1 30469780
115 A-30411012
116 undefined
121 Annex A (normative)Normative references to international publicationswith their corresponding European publications
124 Blank Page
125 English
CONTENTS
131 FOREWORD
133 1 Scope
2 Normative references
134 3 Terms and definitions
137 Figures
Figure 1 – Typical resistance-temperature characteristic for NTC thermistors
139 Figure 2 – Decreased power dissipation curve
141 Figure 3 – Maximum current derating
144 4 General items
4.1 Units and symbols
4.2 Preferred values and appropriate category
4.2.1 General
4.2.2 Appropriate category
4.3 Marking
4.3.1 General
Tables
Table 1 – Lower and upper category temperatures and duration ofthe damp heat, steady state test
145 4.3.2 Marking for small size types such as surface mount NTC thermistors
4.3.3 Coding
4.4 Quality assessment procedures
5 General provisions for measurements and test methods
5.1 General
5.2 Standard atmospheric conditions for testing
146 5.3 Drying and recovery
5.3.1 Drying
5.3.2 Recovery
5.4 Mounting (for surface mount thermistors only)
5.4.1 General
5.4.2 Printed wiring board and land pattern
5.4.3 Mounting on board
148 6 Electrical tests and measurements
6.1 Zero-power resistance
6.1.1 General
6.1.2 Measurement procedures
6.1.3 Requirements
6.2 B-value or resistance ratio
6.2.1 General
6.2.2 Requirements
Figure 4 – Basic circuit for zero-power resistance measurement
149 6.3 Insulation resistance (for insulated types only)
6.3.1 General
6.3.2 Test methods
Figure 5 – Example of Method 1 for testing the insulation resistance
150 Figure 6 – Example of Method 2 for testing the insulation resistance (1)
Figure 7 – Example of Method 2 for testing the insulation resistance (2)
151 Figure 8 – Example of Method 3 for testing the insulation resistance
Figure 9 – Example of Method 4 for testing the insulation resistance
152 6.3.3 Applied voltage
6.3.4 Requirements
6.4 Voltage proof (for insulated types only)
6.4.1 General
6.4.2 Test voltage
6.4.3 Requirements
6.5 Resistance/temperature characteristic
6.5.1 General
6.5.2 Test methods
6.5.3 Requirements
153 6.6 Dissipation factor (δ)
6.6.1 General
6.6.2 Initial measurements
6.6.3 Test methods
Figure 10 – Example of test chamber
154 6.6.4 Requirements
6.7 Thermal time constant by ambient temperature change (τa)
6.7.1 The hot to cold thermal time constant for ambient temperature change
Figure 11 – Dissipation factor measuring circuit
155 6.7.2 The cold to hot thermal time constant for ambient temperature change
6.7.3 Final measurements and requirements
156 6.7.4 Requirements
6.8 Thermal time constant by cooling after self-heating (τc)
6.8.1 General
6.8.2 Initial measurements
6.8.3 Preconditioning
157 6.8.4 Test method
6.8.5 Final measurements and requirements
7 Mechanical test and measurements
7.1 Visual examination and check of dimensions
7.1.1 Visual examination
Figure 12 – Thermal time constant measuring circuit
158 7.1.2 Dimensions
7.2 Robustness of terminations (not applicable to surface mount thermistors)
7.2.1 General
7.2.2 Initial measurements
7.2.3 Test methods
7.2.4 Test Ua1 – Tensile
159 7.2.5 Test Ub – Bending (half the number of terminations)
7.2.6 Test Uc – Torsion (remaining terminations)
7.2.7 Final measurements and requirements
7.3 Vibration
7.3.1 General
7.3.2 Initial measurements
7.3.3 Test procedures
Table 2 – Tensile force
160 7.3.4 Final inspection, measurements and requirements
7.4 Shock
7.4.1 General
7.4.2 Initial measurements
7.4.3 Mounting
7.4.4 Test procedures
7.4.5 Final inspection, measurements and requirements
7.5 Free fall
7.5.1 General
7.5.2 Initial measurements
161 7.5.3 Test procedures
7.5.4 Final inspection, measurements and requirements
7.6 Shear (adhesion) test (for surface mount NTC thermistors only)
7.6.1 General
7.6.2 Initial measurements
7.6.3 Test conditions
7.6.4 Final inspection, measurements and requirements
7.7 Substrate bending test (for surface mount NTC thermistors only)
7.7.1 General
7.7.2 Initial measurements
7.7.3 Test procedures
162 7.7.4 Final inspection, measurements and requirements
8 Environmental and climatic tests
8.1 Rapid change of temperature
8.1.1 General
8.1.2 Initial measurements
8.1.3 Test procedures
8.1.4 Final inspection, measurements and requirements
163 8.2 Thermal shock
8.2.1 General
8.2.2 Initial measurements
8.2.3 Test procedures
8.2.4 Final inspection, measurements and requirements
8.3 Cold
8.3.1 General
8.3.2 Initial measurements
8.3.3 Test procedures
164 8.3.4 Final inspection, measurements and requirements
8.4 Dry heat
8.4.1 General
8.4.2 Initial measurements
8.4.3 Test procedures
8.4.4 Final inspection, measurements and requirements
165 8.5 Damp heat, steady state
8.5.1 General
8.5.2 Initial measurements
8.5.3 Test procedures
8.5.4 Recovery
8.5.5 Final inspection, measurements and requirements
8.6 Endurance
8.6.1 General
166 8.6.2 Endurance at room temperature with applied continuous maximum current (Imax25) (for inrush current-limiting thermistors only)
Figure 13 – Endurance at room temperature with Imax25 evaluating circuit
167 8.6.3 Endurance at room temperature with applied cyclic maximum current (Imax25) (for inrush current-limiting thermistors only)
Figure 14 – Endurance at room temperature with Imax25 evaluating circuit
168 8.6.4 Endurance at T3 and Pmax (for other than inrush current-limiting thermistors only)
169 8.6.5 Endurance at upper category temperature
170 8.6.6 Maximum permissible capacitance (for inrush current-limiting thermistors only)
171 Figure 15 – Maximum permissible capacitance test circuit (Method 1)
Figure 16 – Maximum permissible capacitance test circuit (Method 2)
172 8.7 Salt mist
8.7.1 General
8.7.2 Initial measurements
8.7.3 Test conditions
8.7.4 Final inspection, measurements and requirements
8.8 Sealing
8.9 Composite temperature/humidity cycle
8.9.1 General
8.9.2 Initial measurements
173 8.9.3 Test conditions
8.9.4 Final inspection, measurements and requirements
9 Tests related to component assembly
9.1 Resistance to soldering heat
9.1.1 General
9.1.2 Preconditioning
9.1.3 Initial measurements
9.1.4 Test procedure
9.1.5 Recovery
174 9.1.6 Final inspection, measurement and requirements
9.2 Solderability
9.2.1 General
9.2.2 Initial measurements
9.2.3 Test procedure
9.2.4 Final inspection, measurements and requirements
175 9.3 Component solvent resistance
9.3.1 General
9.3.2 Initial measurements
9.3.3 Test conditions
9.3.4 Requirements
9.4 Solvent resistance of marking
9.4.1 General
9.4.2 Initial measurements
9.4.3 Test conditions
9.4.4 Requirements
176 Annex A (normative)Rules for the preparation of detail specifications fordirectly heated NTC thermistors for electronic equipment foruse within quality assessment systems
A.1 Drafting
A.2 Reference standard
A.3 Circulation
177 Annex B (informative)Typical examples of mountings for measurementsof directly heated thermistors
Table B.1 – Recommended land dimensions
178 Figure B.1 – Mounting for measurements of surface mount thermistors
179 Annex Q (informative)Quality assessment procedures
Q.1 General
Q.1.1 Scope of this annex
180 Q.1.2 Quality assessment definitions
Q.1.3 Rework
Q.1.4 Alternative test methods
181 Q.1.5 Certified test records of released lots
Q.1.6 Unchecked parameters
Q.1.7 Delayed delivery
Q.1.8 Repair
Q.1.9 Registration of approvals
182 Q.1.10 Manufacture outside the geographical limits
Q.2 Qualification approval (QA) procedures
Q.2.1 Eligibility for qualification approval
Q.2.2 Application for qualification approval
Q.2.3 Subcontracting
Q.2.4 Test procedure for the initial product qualification approval
Q.2.5 Granting of qualification approval
Q.2.6 Maintenance of qualification approval
183 Q.2.7 Quality conformance inspection
Q.3 Capability approval (CA) procedures
Q.3.1 General
Q.3.2 Eligibility for capability approval
Q.3.3 Application for capability approval
184 Q.3.4 Subcontracting
Q.3.5 Description of the capability
Q.3.6 Demonstration and verification of capability
Q.3.7 Granting of capability approval
Q.3.8 Maintenance of capability approval
Q.3.9 Quality conformance inspection
185 Q.4 Technology approval (TA) procedure
Q.4.1 General
Q.4.2 Eligibility for technology approval
Q.4.3 Application of technology approval
Q.4.4 Subcontracting
Q.4.5 Description of technology
Q.4.6 Demonstration and verification of the technology
Q.4.7 Granting of technology approval
Q.4.8 Maintenance of technology approval
186 Q.4.9 Quality conformance inspection
Q.5 Interpretation of sampling plans and procedures as described in IEC 60410 for use within quality assessment systems
Q.6 Rules for the preparation of detail specifications for NTC thermistors for electronic equipment for use within quality assessment systems
Q.6.1 Drafting
Q.6.2 Reference standard
187 Q.7 Layout of the first page of a PCP/CQC specification
188 Q.8 Requirements for capability approval test report
Q.8.1 General
Q.8.2 Requirements
Q.8.3 Summary of test information (for each CQC)
Q.8.4 Measurement record
Q.9 Guidance for the extension of endurance tests on fixed thermistor
Q.9.1 Overview
189 Q.9.2 Guidelines
190 Annex X (informative)Cross-references to IEC 60539-1:2016
192 Bibliography

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BS EN IEC 60539-1:2023 - TC
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