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BS EN IEC 61188-6-2:2021

BS EN IEC 61188-6-2:2021

$142.49

Circuit boards and circuit board assemblies. Design and use – Land pattern design. Description of land pattern for the most common surface mounted components (SMD)

Published By Publication Date Number of Pages
BSI 2021 32
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IEC 61188-6-2:2021 describes the requirements of design and use for soldering surfaces of land pattern on circuit boards. This document includes land pattern for surface mounted components. These requirements are based on the solder joint requirements of IEC 61191‑2:2017.

PDF Catalog

PDF Pages PDF Title
2 undefined
5 Annex ZA(normative)Normative references to international publications with their corresponding European publications
7 English
CONTENTS
9 FOREWORD
11 1 Scope
2 Normative references
3 Terms and definitions
4 Kinds of target solder process
5 Land pattern determination
12 6 Requirements
6.1 General requirements
6.2 The proposed land pattern dimension system
6.2.1 Land pattern design
13 6.2.2 Solder joint fillet design
14 Figures
Figure 1 – Example of the dimensional relationship between the drawings ofcomponents with rectangular terminals and the land pattern design
15 6.2.3 Courtyard excess
6.2.4 Rounding factor
6.2.5 Relationship between terminal classifications and class of land pattern
6.2.6 Terminal types
Tables
Table 1 – Relationship between terminal classifications and class of land pattern
16 Figure 2 – Definitions of dimensions of the flat bottom terminal types
19 6.3 Land pattern for wave soldering
6.3.1 General
6.3.2 Flat bottom terminals
6.3.3 Flat bottom and vertical side terminals
Figure 3 – Definitions of dimensions of the flat bottom and vertical side terminal types
Table 2 – Conformity to the wave soldering of the terminal types
20 6.4 Land pattern for reflow soldering
6.4.1 General
6.4.2 Flat bottom terminals
6.4.3 Flat bottom and vertical side terminals
Table 3 – Land pattern dimensions for Flat bottom terminals soldered by reflow soldering
21 6.4.4 Remarks
Table 4 – Land pattern dimensions for flat bottom and vertical side terminals soldered by reflow soldering
22 Figure 4 – Solder touches image
23 Figure 5 – Unacceptable conditions for overhangs
24 Annex A (informative) The relation between terminal type and component packages
A.1 Flat bottom terminals
A.2 Flat bottom and vertical side terminals
Table A.1 – Terminal type classifications 1 – Flat bottom terminals
25 Table A.2 – Terminal type classifications 2 – Flat bottom and vertical side terminals
27 Annex B (informative)Solder joint fillet designs for wave soldering
Table B.1 – Solder joint fillet design for wave soldering
28 Annex C (informative)Courtyard excess for reflow soldering
C.1 Courtyard excess for flat bottom terminals to use the land pattern for reflow soldering
C.2 Courtyard excess for flat bottom and vertical side terminals to use the land pattern for reflow soldering
Table C.1 – Courtyard excess for flat bottom terminals to use the land pattern for reflow soldering
29 Table C.2 – Courtyard excess for flat bottom and vertical side terminals to use the land pattern for reflow soldering
30 Bibliography

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BS EN IEC 61188-6-2:2021
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