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BS IEC 62899-402-1:2017

BS IEC 62899-402-1:2017

$102.76

Printed electronics – Printability. Measurement of qualities. Pattern width

Published By Publication Date Number of Pages
BSI 2017 16
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This part of IEC 62899 specifies the measurement methods of the widths of the printed patterns in printed electronics. These printed pattern widths are treated as two-dimensional on a substrate. When the patterns are definitely affected by three-dimensional configurations, these are specified in measurement methods for thickness in printed electronics.

PDF Catalog

PDF Pages PDF Title
4 CONTENTS
5 FOREWORD
7 INTRODUCTION
8 1 Scope
2 Normative references
3 Terms and definitions
9 4 Atmospheric conditions for evaluation and conditioning
5 Measuring methods and instruments
5.1 Measuring instrument
5.2 Preparation of imaging (specimen)
5.3 Measuring method
10 5.4 Obtaining width and related attributes
Figure 1 – Captured image of two edges of pattern and inner/outer edge lines
Figure 2 – Obtained position difference as a function of y
11 6 Report of results
6.1 Measurement identification information
6.2 Instrument system and its specification
6.3 Measuring position
6.4 Results
12 Table 1 – Example of reporting items
13 Annex A (normative) Drawing method of inner edge lines and outer edge lines
14 Bibliography

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BS IEC 62899-402-1:2017
$102.76