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BSI PD IEC/TR 60068-3-12:2007

BSI PD IEC/TR 60068-3-12:2007

$102.76

Environmental testing – Supporting documentation and guidance. Method to evaluate a possible lead-free solder reflow temperature profile

Published By Publication Date Number of Pages
BSI 2007 20
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Presents two approaches to establish a possible temperature profile for a lead-free reflow soldering process using SnAgCu solder paste. The presented process window covers a great variety of electronic products, including a large range of package sizes (molded active electronic components, passive components and electromechanical components)

BSI PD IEC/TR 60068-3-12:2007
$102.76