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BSI PD IEC TR 61191-9:2023

BSI PD IEC TR 61191-9:2023

$215.11

Printed board assemblies – Electrochemical reliability and ionic contamination on printed circuit board assemblies for use in automotive applications. Best practices

Published By Publication Date Number of Pages
BSI 2023 76
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PDF Catalog

PDF Pages PDF Title
2 undefined
4 CONTENTS
7 FOREWORD
9 INTRODUCTION
10 1 Scope
2 Normative references
3 Terms, definitions and abbreviated terms
11 3.1 Terms and definitions related to management
3.2 Technical terms and definitions
12 3.3 Abbreviated terms
4 Failure mode electrochemical migration
4.1 Background of electrochemical migration
13 Figures
Figure 1 – Principal reaction mechanism of ECM
Figure 2 – Uncertainty in local conditions determines ECM failures
14 4.2 Complexity of electrochemical migration
Figure 3 – Occurrence of ECM failures during humidity tests
15 4.3 Conductive anodic filament (CAF) and anodic migration phenomena (AMP)
Figure 4 – VENN diagram showing the factors influencing ECM
16 4.4 Creep corrosion
Figure 5 – Occurrence of CAF and AMP
17 5 Electrochemical migration and relevance of ionic contamination
5.1 General aspects
5.2 Background of ionic contamination measurement
Figure 6 – Creep corrosion caused by corrosive gases
18 Figure 7 – Ionic contamination measurement
19 5.3 Restrictions and limitations of ionic contamination measurement for no-clean assemblies
5.3.1 Factors determining the result
Figure 8 – Principal operation mode (fluid flow) of ROSE
20 5.3.2 Influence by solvent on measurement of no-clean assemblies
Figure 9 – Effect of solvent composition on the obtained ROSE results
Figure 10 – Effect of solvent composition on the obtained ion chromatography result
23 5.3.3 Influence of extraction time on measurement of no-clean assemblies
Figure 11 – Comparison of ROSE values with different solvent mixtures and material variations of the CBA
24 5.3.4 Influence by assembly and interconnect technology on measurement of no-clean assemblies
Figure 12 – Variation in ROSE values depending on technology used
25 Figure 13 – Destructive action of solvent on resin matrix
Figure 14 – Comparison of the resin change
26 5.3.5 Ion chromatography of no-clean assemblies CBA
Figure 15 – Destructive action of solvent on resin matrix and chipping effect
28 Tables
Table 1 – List of ions based on IPC-TM650, 2.3.28 [21]
29 Table 2 – Fingerprint after ion chromatography of no-clean assembly shown in Figure 16
30 5.4 Restrictions and limitations of Ionic contamination measurement for cleaned products
5.4.1 Ionic contamination of unpopulated CBs (bare board, state of delivery)
Figure 16 – Assembly manufactured with 2x SMT and 1x THT process for the connector
31 Figure 17 – Comparison of SPC-charts from 1-year monitoring of different CB suppliers and two different iSn final finish processes
32 Figure 18 – Differences in ROSE values for unpopulated CBs depending on the extraction method
33 Table 3 – Fingerprint after ion chromatography of bare CBs (state of delivery)
34 5.4.2 Ionic contamination of electronic and electromechanic components
Figure 19 – Reduction of ionic contamination on bare CBs (state of delivery from CB supplier) by leadfree reflow step without solder paste or components
35 Figure 20 – Influence of components on the ionic contamination based on B52‑standard
36 5.4.3 Ionic contamination of cleaned CBAs
Figure 21 – Formation of a white veil or residue on MLCCs during active humidity test
37 Table 4 – Fingerprint after ion chromatography of a bare CB and the respective PBA in uncleaned and cleaned condition
38 Figure 22 – Chromatogram derived from ion chromatography measurement of a cleaned CBA
39 5.5 How to do – Guidance to use cases
5.5.1 When is the use of ROSE measurements reasonable?
Table 5 – Fingerprint after ion chromatography of an uncleaned CBA compared to the cleaned CBA and after removing the components
41 5.5.2 When is the use of ion chromatography reasonable?
5.5.3 At what point in the manufacturing sequence ionic contamination measurements are carried out, if a fingerprint or the basis for process control is to be established?
42 5.5.4 How is the sampling for ROSE and IC done?
5.5.5 How is a product-specific process control limit based on ROSE determined?
5.6 Examples for good practice
5.6.1 Ways to achieve objective evidence
43 5.6.2 Introduction of a new product family with new materials
Figure 23 – Approach for achieving objective evidence for a qualified manufacturing process in the automotive industry
44 5.6.3 Adaptation of an ECU for a new vehicle type
Figure 24 – ROSE as process control tool
45 6 Surface insulation resistance (SIR)
6.1 SIR – An early stage method to identify critical material combinations and faulty processing
6.2 Fundamental parameters of influence on SIR
6.2.1 General aspects
46 Figure 25 – View on SIR measurement
47 Figure 26 – Principal course of SIR curves
Figure 27 – Response graph concerning stabilized SIR-value after 168 h from a DoE with B53-similar test coupons (bare CB)
48 6.2.2 Influence of climate
Figure 28 – SIR measurement with B24-CB, no-clean SMT solder paste
49 6.2.3 Influence of voltage
50 6.2.4 Influence of distance
Figure 29 – Increase in ECM propensity depending on voltage applied (U) and Cu-Cu distances (d) of comb structures
51 6.2.5 The limit 100 MΩ and optical inspection
Figure 30 – Layout of B53 test coupon
52 6.2.6 Influence of materials
53 6.3 Harmonization of SIR test conditions for characterization of materials for automotive applications
6.4 Different steps of SIR testing
6.4.1 General procedure
Table 6 – Common test conditions for basic material evaluation
54 6.4.2 Base material
6.4.3 Solder mask and final finish
55 6.4.4 SMT solder paste
6.4.5 THT fluxes
Figure 31 – B53 with solder mask, partially covered and fully covered comb structures
56 6.4.6 Encapsulations and adhesives
6.4.7 Process qualification at CB manufacturer
57 7 Comprehensive SIR testing – B52-approach
7.1 General aspects
Table 7 – Recommended SIR test conditions for basic material- and process release for the outer layer manufactured by a CB supplier
58 7.2 The main B52 test board
Figure 32 – B52 CBA after SMT process, layout slightly adapted to fulfil company internal layout rules
59 7.3 The test patterns
Figure 33 – Pattern of B52 CB, layout slightly adapted to fulfill company internal layout rules
60 Table 8 – List of materials for components with recommendations for minor adaptations
61 7.4 Processing of B52 boards
7.5 Sample size for SIR testing of B52 test coupons
7.6 Preparation for SIR testing
62 7.7 Sequence of SIR testing
Table 9 – Sequence for SIR testing of B52-CBAs for general material- and process qualification
63 Figure 34 – Positive example of comprehensive SIR tests obtained for qualification of a SMT process
Figure 35 – Negative example of a contaminated B52-sample, tested by the sequence of constant climate and cyclic damp heat climate
64 7.8 Evaluation
8 Example for good practice
8.1 Methodology for material and process qualification, process control
8.2 Step 1 – Material qualification
65 Figure 36 – SIR test coupon, similar to B53, for principal material qualification
Figure 37 – SIR test with constant climate and cyclic damp heat condition
66 8.3 Step 2 – Product design verification and process validation
Figure 38 – B52 test board and example of SIR curve
Figure 39 – Example of the product that was realized by the released materials and process
67 8.4 Step 3 – Definition of process control limits
Figure 40 – Ionic contamination test results from 4 repetitions of PV samples
Figure 41 – Results of ionic residue testing and calculation of upper control limit (UCL)
68 Figure 42 – Run chart derived from 2 samples per month during mass production
69 Annex A (informative)SIR measurement for SMT solder paste – Representative example
A.1 Purpose
A.2 Equipment
A.3 Example of an instruction how to perform the test
72 Bibliography

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BSI PD IEC TR 61191-9:2023
$215.11