IEC 60191-6-10:2003
$22.75
Mechanical standardization of semiconductor devices – Part 6-10: General rules for the preparation of outline drawings of surface mounted semiconductor device packages – Dimensions of P-VSON
| Published By | Publication Date | Number of Pages |
| IEC | 2003-11-19 | 28 |
IEC 60191-6-10:2003 provides the common outline drawings and dimensions for all types of structures and composed materials of plastic very thin small outline non-lead package (hereinafter called P-VSON).
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