IEC 61188-5-5:2007

$43.55

Printed boards and printed board assemblies – Design and use – Part 5-5: Attachment (land/joint) considerations – Components with gull-wing leads on four sides

Published By	Publication Date	Number of Pages
IEC	2007-10-30	90

Guaranteed Safe Checkout

Categories: 31.180 - Printed circuits and boards, IEC

If you have any questions, feel free to reach out to our online customer service team by clicking on the bottom right corner. We’re here to assist you 24/7.
Email:[email protected]

Description

IEC 61188-5-5:2007 provides information on land pattern geometries used for the surface attachment of electronic components with gull-wing leads on four sides. The intent of the information presented herein is to provide the appropriate size, shape and tolerances of surface mount land patterns to ensure sufficient area for the appropriate solder fillet, and also allow for inspection, testing and reworking of those solder joints.

This publication is to be read in conjunction with IEC 61188-5-1 :2002.

Additional information

Published Code	IEC
Published By	International Electrotechnical Commission
Publication Date	2007-10-30
Pages Count	90
Language	France
Edition	1.0
File Size	1.3 MB
ICS Codes	31.180 - Printed circuits and boards

Preview PDF


PDF Format	Searchable	Printable	Preview Now

IEC 61188-5-5:2007

Related products