IEC 61191-2:2017

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Printed board assemblies – Part 2: Sectional specification – Requirements for surface mount soldered assemblies

Published By	Publication Date	Number of Pages
IEC	2017-05-23	70

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Categories: 31.190 - Electronic component assemblies, 31.240 - Mechanical structures for electronic equipment, IEC

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Description

IEC 61191-2:2017 gives the requirements for surface mount solder connections. The requirements pertain to those assemblies that are totally surface mounted or to the surface mounted portions of those assemblies that include other related technologies (e.g. through-hole, chip mounting, terminal mounting, etc.).
This edition includes the following significant technical changes with respect to the previous edition:
a) the requirements have been updated to be compliant with the acceptance criteria in IPC-A-610F;
b) some of the terminology used in the document has been updated;
c) references to IEC standards have been corrected;
d) five termination styles have been added.
The contents of the corrigendum of September 2019 have been included in this copy.

Additional information

Published Code	IEC
Published By	International Electrotechnical Commission
Publication Date	2017-05-23
Pages Count	70
Language	France
Edition	3.0
File Size	2.5 MB
ICS Codes	31.190 - Electronic component assemblies 31.240 - Mechanical structures for electronic equipment

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IEC 61191-2:2017

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