{"id":421383,"date":"2024-10-20T06:35:53","date_gmt":"2024-10-20T06:35:53","guid":{"rendered":"https:\/\/pdfstandards.shop\/product\/uncategorized\/bs-en-60191-42014a12018-2\/"},"modified":"2024-10-26T12:21:08","modified_gmt":"2024-10-26T12:21:08","slug":"bs-en-60191-42014a12018-2","status":"publish","type":"product","link":"https:\/\/pdfstandards.shop\/product\/publishers\/bsi\/bs-en-60191-42014a12018-2\/","title":{"rendered":"BS EN 60191-4:2014+A1:2018"},"content":{"rendered":"
This part of IEC 60191 specifies a method for the designation of package outlines and for the classification of forms of package outlines for semiconductor devices and a systematic method for generating universal descriptive designators for semiconductor device packages.<\/p>\n
The descriptive designator provides a useful communication tool but has no implied control for assuring package interchangeability.<\/p>\n
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2<\/td>\n | undefined <\/td>\n<\/tr>\n | ||||||
4<\/td>\n | Untitled <\/td>\n<\/tr>\n | ||||||
5<\/td>\n | English CONTENTS <\/td>\n<\/tr>\n | ||||||
6<\/td>\n | FOREWORD <\/td>\n<\/tr>\n | ||||||
8<\/td>\n | 1 Scope 2 Coding system of package outlines for semiconductor devices 3 Classification into forms of package outlines for semiconductor devices <\/td>\n<\/tr>\n | ||||||
9<\/td>\n | 4 Coding system for semiconductor-device packages 4.1 General 4.2 New descriptive codes 4.3 Descriptive designators 4.3.1 General remarks 4.3.2 Minimum descriptive designator <\/td>\n<\/tr>\n | ||||||
10<\/td>\n | Figures Figure 1 \u2013 Descriptive coding for semiconductor device packages <\/td>\n<\/tr>\n | ||||||
11<\/td>\n | 4.3.3 Terminal-position prefix 4.3.4 Package-body-material prefix Tables Table 1 \u2013 Package-outline-style codes <\/td>\n<\/tr>\n | ||||||
12<\/td>\n | 4.3.5 Package-specific feature prefix 4.3.6 Lead-form and terminal-count suffixes Table 2 \u2013 Terminal-position prefixes <\/td>\n<\/tr>\n | ||||||
13<\/td>\n | Figure 2 \u2013 Relationship of codes to profile Table 3 \u2013 Prefixes for predominant package-body material Table 4 \u2013 Prefixes for package-specific features <\/td>\n<\/tr>\n | ||||||
14<\/td>\n | 4.3.7 Detailed information field <\/td>\n<\/tr>\n | ||||||
15<\/td>\n | 5 Coding system of package-outline styles Table 5 \u2013 Suffixes for lead form (or terminal shape) <\/td>\n<\/tr>\n | ||||||
18<\/td>\n | Annex A (informative) Examples of descriptive coding system application <\/td>\n<\/tr>\n | ||||||
19<\/td>\n | Table A.1 \u2013 Descriptive coding system application <\/td>\n<\/tr>\n | ||||||
20<\/td>\n | Figure A.1 \u2013 Typical package styles and descriptive coding system (1 of 4) <\/td>\n<\/tr>\n | ||||||
24<\/td>\n | Figure A.2 \u2013 Examples of lead forms (or terminal shapes) <\/td>\n<\/tr>\n | ||||||
25<\/td>\n | Annex B (informative) Derivation and application of the descriptive coding system \u2013 Common package names Figure B.1 \u2013 Descriptive coding system for common name of semiconductor-device package <\/td>\n<\/tr>\n | ||||||
26<\/td>\n | Table B.1 \u2013 Basic package code and names <\/td>\n<\/tr>\n | ||||||
27<\/td>\n | Table B.2 \u2013 Common package name and descriptive code examples <\/td>\n<\/tr>\n | ||||||
28<\/td>\n | Annex C (informative) Terminology of semiconductor package outlines <\/td>\n<\/tr>\n | ||||||
29<\/td>\n | Table C.1 \u2013 Package name and parts name <\/td>\n<\/tr>\n<\/table>\n","protected":false},"excerpt":{"rendered":" Mechanical standardization of semiconductor devices – Coding system and classification into forms of package outlines for semiconductor device packages<\/b><\/p>\n |