{"id":422390,"date":"2024-10-20T06:41:00","date_gmt":"2024-10-20T06:41:00","guid":{"rendered":"https:\/\/pdfstandards.shop\/product\/uncategorized\/bsi-pd-iec-ts-62686-12020-2\/"},"modified":"2024-10-26T12:31:01","modified_gmt":"2024-10-26T12:31:01","slug":"bsi-pd-iec-ts-62686-12020-2","status":"publish","type":"product","link":"https:\/\/pdfstandards.shop\/product\/publishers\/bsi\/bsi-pd-iec-ts-62686-12020-2\/","title":{"rendered":"BSI PD IEC TS 62686-1:2020"},"content":{"rendered":"

This part of IEC 62686, which is a Technical Specification, defines the minimum requirements for general purpose “off the shelf” COTS (commercial off-the-shelf) integrated circuits and discrete semiconductors for ADHP (aerospace, defence and high performance) applications.<\/p>\n

This document applies to all components that can be operated in ADHP applications within the manufacturers\u2019 publicly available data sheet limits in conjunction with IEC 62239-1. It can be used by other high performance and high reliability industries, at their discretion.<\/p>\n

ADHP application requirements are not necessarily fulfilled by this document alone. ADHP OEMs (original equipment manufacturers) might need to consider redesigning their products or conducting further testing to verify suitability in ADHP applications using their IEC 62239-1 ECMP procedures. Alternatively, a component in accordance with IEC TS 62564-1 can be more suitable.<\/p>\n

\n

NOTE Component qualification and outgoing quality discussed herein do not addres component atmospheric radations SEE effects per IEC 62396-1.<\/p>\n<\/blockquote>\n

PDF Catalog<\/h4>\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n
PDF Pages<\/th>\nPDF Title<\/th>\n<\/tr>\n
2<\/td>\nundefined <\/td>\n<\/tr>\n
4<\/td>\nCONTENTS <\/td>\n<\/tr>\n
8<\/td>\nFOREWORD <\/td>\n<\/tr>\n
10<\/td>\nINTRODUCTION <\/td>\n<\/tr>\n
11<\/td>\n1 Scope
2 Normative references <\/td>\n<\/tr>\n
12<\/td>\n3 Terms, definitions and abbreviated terms
3.1 Terms and definitions <\/td>\n<\/tr>\n
14<\/td>\n3.2 Abbreviated terms <\/td>\n<\/tr>\n
16<\/td>\n4 Technical requirements
4.1 General
4.1.1 Overview <\/td>\n<\/tr>\n
17<\/td>\n4.1.2 Automotive components
4.2 Procedures
4.2.1 General
4.2.2 Product discontinuance
4.2.3 ESD protection during manufacture <\/td>\n<\/tr>\n
18<\/td>\n4.2.4 Specification control
4.2.5 Traceability including anti-counterfeit measures
4.3 Product or process change notification (PCN)
4.3.1 General
4.3.2 Notification
4.3.3 Notification details <\/td>\n<\/tr>\n
19<\/td>\n4.3.4 Notifiable changes
4.4 Shipment controls
4.4.1 General
4.4.2 Shipping container and date code marking
4.4.3 Date code remarking
4.4.4 Inner container formation <\/td>\n<\/tr>\n
20<\/td>\n4.4.5 Date code age on delivery
4.4.6 ESD marking
4.4.7 MSL
4.4.8 Lead-free marking
4.4.9 Labels <\/td>\n<\/tr>\n
21<\/td>\n4.5 Electrical
4.5.1 General
4.5.2 Electrical test
4.5.3 Electrical parameter assessment
Tables
Table 1 \u2013 Label requirements <\/td>\n<\/tr>\n
22<\/td>\n4.5.4 SDRAM memories
4.5.5 Logic families
4.5.6 Power MOSFETs
4.5.7 Silicon rectifier diodes
4.6 Mechanical
4.6.1 General
4.6.2 Device marking
4.6.3 Small packages
4.6.4 Moisture sensitivity <\/td>\n<\/tr>\n
23<\/td>\n4.6.5 Robustness of hermetic seals
4.6.6 Termination finishes
4.7 Audit capability
4.7.1 General
4.7.2 Internal quality audits
Table 2 \u2013 Internal quality audit requirements <\/td>\n<\/tr>\n
24<\/td>\n4.7.3 Subcontract manufacturing
4.8 Quality assurance
4.8.1 General
4.8.2 Quality system
4.8.3 Sampling plans
4.8.4 Failure analysis support
4.8.5 Outgoing quality <\/td>\n<\/tr>\n
25<\/td>\n4.9 Qualification
4.9.1 General
Table 3 \u2013 Outgoing quality <\/td>\n<\/tr>\n
26<\/td>\n4.9.2 Methodology <\/td>\n<\/tr>\n
27<\/td>\n4.9.3 Test samples <\/td>\n<\/tr>\n
28<\/td>\n4.9.4 Qualification categories
4.9.5 Maintenance of qualification standards
4.9.6 In-process test results <\/td>\n<\/tr>\n
29<\/td>\nTable 4 \u2013 Technology\/family qualification and device qualification (1 of 3) <\/td>\n<\/tr>\n
32<\/td>\n4.9.7 Product monitor results
4.9.8 References
4.9.9 Qualification report
4.9.10 Archiving
4.9.11 Qualification by similarity
4.9.12 Similarity assessment <\/td>\n<\/tr>\n
33<\/td>\n4.10 Reliability
4.10.1 General
4.10.2 Operating reliability
4.10.3 Failure criteria <\/td>\n<\/tr>\n
34<\/td>\n4.10.4 Corrective action
4.10.5 Warranty
4.10.6 Single event effects (SEEs)
4.11 Product monitor
4.11.1 General
4.11.2 Monitor programme
4.11.3 Problem notification <\/td>\n<\/tr>\n
35<\/td>\n4.11.4 Data reporting
4.11.5 Samples
4.11.6 Corrective action
4.11.7 Product monitor results
4.11.8 Accumulated test data <\/td>\n<\/tr>\n
36<\/td>\n4.12 Environmental health and safety (EHS)
4.12.1 General
4.12.2 EHS compliance
4.12.3 Device handling
4.12.4 Device materials
4.13 Shipping containers
4.13.1 General
4.13.2 ESD requirements
Table 5 \u2013 Product monitor tests <\/td>\n<\/tr>\n
38<\/td>\n4.13.3 Magazine reuse
4.13.4 Tubes
4.13.5 Trays <\/td>\n<\/tr>\n
39<\/td>\n4.13.6 Tape and reel
4.14 Compliance with internal standards <\/td>\n<\/tr>\n
40<\/td>\nAnnex A (informative) Test code (TC) information
A.1 General
A.2 TC1 \u2013 Autoclave (ATC)
A.3 TC2 \u2013 Bond strength, internal (BS)
A.4 TC3 \u2013 Die shear strength (DS)
A.5 TC4 \u2013 Electromigration (EM) <\/td>\n<\/tr>\n
41<\/td>\nA.6 TC5 \u2013 Electrostatic discharge (ESD)
A.7 TC6 \u2013 Electrical test (ET)
A.8 TC7 \u2013 Electrical distributions (EDs) <\/td>\n<\/tr>\n
42<\/td>\nA.9 TC8 \u2013 Flammability (FL)
A.10 TC9 \u2013 Hot carrier injection (HCI)
A.11 TC10 \u2013 Hermeticity (HE)
A.12 TC11 \u2013 High temperature bake (HTB)
Table A.1 \u2013 Conditions of the DC over the voltage stress methodof JP001.01 or IEC 62416 test <\/td>\n<\/tr>\n
43<\/td>\nA.13 TC12 \u2013 High temperature blocking bias (HTBB)
A.14 TC13 \u2013 High temperature gate bias (HTGB)
A.15 TC14 \u2013 High temperature reverse bias (HTRB)
A.16 TC15 \u2013 High temperature operating life (HTOL)
A.16.1 General
A.16.2 Qualification conditions <\/td>\n<\/tr>\n
44<\/td>\nA.16.3 Test results assessment
A.16.4 Temperature acceleration factor
Table A.2 \u2013 Examples of temperature acceleration factors <\/td>\n<\/tr>\n
45<\/td>\nA.16.5 Supply voltage acceleration factor
A.17 TC16 \u2013 Latch-up (LU)
A.18 TC17 \u2013 Lead integrity (LI)
A.19 TC18 \u2013 Lid torque (LT)
A.20 TC19 \u2013 Mechanical sequence (MS)
A.20.1 General <\/td>\n<\/tr>\n
46<\/td>\nA.20.2 Constant acceleration
A.20.3 Vibration (variable frequency)
A.20.4 Mechanical shock
A.21 TC20 \u2013 Marking permanency (MP)
A.22 TC21 \u2013 Non-volatile memory operating life (NVL) <\/td>\n<\/tr>\n
47<\/td>\nA.23 TC22 \u2013 Time dependent dielectric breakdown (oxide integrity) (OI)
A.24 TC23 \u2013 Package dimensions (PD)
A.25 TC24 \u2013 Power cycling (PTC)
A.26 TC25 \u2013 Resistance to solder heat (RSH) <\/td>\n<\/tr>\n
48<\/td>\nA.27 TC26 \u2013 Solder preconditioning (PC)
A.28 TC27 \u2013 Solderability (SD)
A.29 TC28 \u2013 Soft error rate (SER)
Table A.3 \u2013 Dip and look test references <\/td>\n<\/tr>\n
49<\/td>\nA.30 TC29 \u2013 Steady state operating life (SSOL)
A.31 TC30 \u2013 Temperature cycling (TPC)
Table A.4 \u2013 Parameter values for consideration
Table A.5 \u2013 Test conditions <\/td>\n<\/tr>\n
50<\/td>\nA.32 TC31 \u2013 Temperature humidity reverse bias (THRB)
A.33 TC32 \u2013 Temperature humidity bias (THB or HAST)
A.34 TC33 \u2013 Terminal strength (TS)
A.35 TC34 \u2013 Thermal resistance (thermal impedance) (TR)
Table A.6 \u2013 Test methods <\/td>\n<\/tr>\n
51<\/td>\nA.36 TC35 \u2013 Visual inspection (VI)
A.36.1 TC35a \u2013 External visual inspection
A.36.2 TC35b \u2013 Internal visual inspection <\/td>\n<\/tr>\n
52<\/td>\nA.37 TC36 \u2013 Water vapour content, internal (WV)
A.38 TC37 \u2013 Xray inspection (XR)
A.39 TC38 \u2013 Moisture sensitivity level (MSL)
A.40 TC39 \u2013 Ball shear test (BST)
A.41 TC40 \u2013 Negative bias temperature instability (NBTI) <\/td>\n<\/tr>\n
53<\/td>\nA.42 TC41 \u2013 Accelerated tin whisker test <\/td>\n<\/tr>\n
54<\/td>\nAnnex B (informative) Typical automotive component requirements <\/td>\n<\/tr>\n
56<\/td>\nAnnex C (informative) Requirement matrix for IEC TS 62686-1 verification
Table C.1 \u2013 Requirement matrix <\/td>\n<\/tr>\n
80<\/td>\nBibliography <\/td>\n<\/tr>\n<\/table>\n","protected":false},"excerpt":{"rendered":"

Process management for avionics. Electronic components for aerospace, defence and high performance (ADHP) applications – General requirements for high reliability integrated circuits and discrete semiconductors<\/b><\/p>\n\n\n\n\n
Published By<\/td>\nPublication Date<\/td>\nNumber of Pages<\/td>\n<\/tr>\n
BSI<\/b><\/a><\/td>\n2020<\/td>\n86<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n","protected":false},"featured_media":422398,"template":"","meta":{"rank_math_lock_modified_date":false,"ep_exclude_from_search":false},"product_cat":[89,2641],"product_tag":[],"class_list":{"0":"post-422390","1":"product","2":"type-product","3":"status-publish","4":"has-post-thumbnail","6":"product_cat-03-100-50","7":"product_cat-bsi","9":"first","10":"instock","11":"sold-individually","12":"shipping-taxable","13":"purchasable","14":"product-type-simple"},"_links":{"self":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product\/422390","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product"}],"about":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/types\/product"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/media\/422398"}],"wp:attachment":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/media?parent=422390"}],"wp:term":[{"taxonomy":"product_cat","embeddable":true,"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product_cat?post=422390"},{"taxonomy":"product_tag","embeddable":true,"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product_tag?post=422390"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}