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BS EN IEC 63215-2:2023

BS EN IEC 63215-2:2023

$142.49

Endurance test methods for die attach materials – Temperature cycling test method for die attach materials applied to discrete type power electronic devices

Published By Publication Date Number of Pages
BSI 2023 28
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PDF Pages PDF Title
2 undefined
5 Annex ZA (normative)Normative references to international publicationswith their corresponding European publications
6 English
CONTENTS
8 FOREWORD
10 1 Scope
2 Normative references
11 3 Terms, definitions and abbreviated terms
3.1 Terms and definitions
3.2 Abbreviated terms
4 General
12 5 Test apparatus
5.1 Die bonding equipment
5.2 Temperature cycling chamber
5.3 Thermal resistance measuring equipment
5.4 Ultrasonic flaw inspection equipment
6 Specimen
6.1 General
Figures
Figure 1 – Regions for evaluation for discrete type power electronic device
13 6.2 Preparation of specimen
7 Evaluation test
7.1 Test method
7.1.1 General
7.1.2 Temperature cycling test
Figure 2 – Temperature cycling test
14 7.1.3 Test conditions
7.1.4 End of test criteria
7.2 Inspection and measurement
7.2.1 Visual inspection
7.2.2 Thermal resistance measurement
Tables
Table 1 – Temperature cycling test conditions
15 7.2.3 Ultrasonic flaw inspection
7.3 Test procedure
7.3.1 Test preparation
7.3.2 Preconditioning
7.3.3 Initial measurement
7.3.4 Test
7.3.5 Intermediate measurement
7.3.6 Post-test treatment
7.3.7 Final judgment
16 8 Failure cycle
9 Items to be specified in the product specification
17 Annex A (normative)Thermal resistance measuring method at die attach region
A.1 Thermal resistance measuring method
A.1.1 General
A.1.2 Temperature characteristics measurement for TEG chip
Figure A.1 – Example of the structure of the specimen using a TEG chip
18 A.1.3 Thermal resistance measurement method for TEG chip
Figure A.2 – Example of temperature characteristics – TEG chip
19 A.2 Correction of thermal resistance criteria
Figure A.3 – Example of structure for thermal resistance measurementfor a power electronic device
20 Figure A.4 – Example of relationship between thermal resistance and die attach damage
Table A.1 – Example of thermal resistance value (Rth) result
21 Figure A.5 – Example of ultrasonic flaw inspection result
22 Annex B (informative)Discrete type specimen preparation using a heating resistor TEG chip
B.1 Power electronic device specimen
B.1.1 General
B.1.2 Power electronic device chip
B.1.3 Base substrate
Figure B.1 – Example of TEG chip
23 B.1.4 Package mould
B.1.5 Surface treatment
B.2 Die attach materials
B.3 Specimen preparation
24 Figure B.2 – Typical reflow soldering profile for Sn96,5Ag3Cu,5 solder alloy
25 Figure B.3 – Example of specimen – TEG chip
26 Annex C (informative)Reliability performance index for die attach joint –Discrete type power electronic device
Table C.1 – Reliability performance index for die attach joint –Discrete type power electronic device
27 Bibliography

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BS EN IEC 63215-2:2023
$142.49