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BS EN IEC 63244-1:2021

BS EN IEC 63244-1:2021

$167.15

Semiconductor devices. Semiconductor devices for wireless power transfer and charging – General requirements and specifications

Published By Publication Date Number of Pages
BSI 2021 40
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PDF Catalog

PDF Pages PDF Title
2 undefined
5 Annex ZA (normative)Normative references to international publicationswith their corresponding European publications
7 English
CONTENTS
9 FOREWORD
11 INTRODUCTION
12 1 Scope
2 Normative references
13 3 Terms, definitions and symbols
3.1 Terms and definitions
3.1.1 General terminology
14 3.1.2 Terminology for near-field based wireless power transfer
15 3.1.3 Terminology for far-field based wireless power transfer
16 3.2 Symbols and abbreviated terms
17 4 Classification
Tables
Table 1 – Letter symbols and abbreviated terms
18 Figures
Figure 1 – Classification of WET technologies
Table 2 – Example of blank specifications: classification of wireless power transfer methods and distance according to products and power consumption
19 5 Test items for reliability
5.1 General
5.2 IP rating
Figure 2 – Example of reliability test conditions and items
20 5.3 Temperature test
5.4 Humidity test
5.5 Mechanical impact and vibration test
5.6 EMC test
5.6.1 General
5.6.2 Electromagnetic immunity
5.6.3 Electromagnetic emission
21 6 Performance evaluation items
6.1 Efficiency
6.1.1 General
6.1.2 Block diagram for efficiency analysis
Figure 3 – Block diagram for efficiency analysis of MF WPT system
Figure 4 – Block diagram for efficiency analysis of EMW WPT system
22 6.1.3 Component-level efficiency
23 Figure 5 – Measurement setup for AC to DC convertingefficiency or rectifying efficiency
24 Figure 6 – Measurement setup for DC to DC converting efficiency
25 6.1.4 Module-level efficiency
Figure 7 – Measurement setup for DC to AC converting efficiency
26 Figure 8 – Measurement setup for coupling efficiencybetween transmitting and receiving coils
27 6.1.5 System-level power transfer efficiency
Figure 9 – Measurement setup for power transfer efficiency between power transmitting and receiving antennas
28 6.2 Evaluation components in PTx and PRx
6.2.1 General
6.2.2 Rectifier and ripple smoothing circuit
Figure 10 – Semiconductor components in PTx and PRx
29 Table 3 – Example of blank specifications of a rectifier diode
30 Figure 11 – Half-wave rectifier and input/output waveform
31 6.2.3 DC to DC converter
Figure 12 – Full-wave rectifier and input/output waveform
Figure 13 – Diode- bridge rectifier and RC smoothing circuits
32 6.2.4 Inverter
Figure 14 – Example of step down converter (Buck converter)and step up converter (Boost converter)
Table 4 – Example of blank specifications of a step- down DC-to-DC converter
33 Figure 15 – Example of equivalent circuit and square AC output signal
Table 5 – Example of blank specifications of an inverter used for MF WPT
34 6.2.5 Variable gain amplifier (VGA)
Figure 16 – Block diagram of VGA
35 Figure 17 – 3 dB bandwidth
Figure 18 – P1dB, MDS and dynamic input range of a variable gain amplifier
37 Annex A (informative)Field regions for electromagnetically short antenna
Figure A.1 – Field regions for electromagnetically short antenna
38 Bibliography

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BS EN IEC 63244-1:2021
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