BS EN ISO 9453:2020
$142.49
Soft solder alloys. Chemical compositions and forms
| Published By | Publication Date | Number of Pages |
| BSI | 2020 | 24 |
This document specifies the requirements for chemical composition for soft solder alloys containing two or more of: tin, lead, antimony, copper, silver, bismuth, zinc, indium and/or cadmium.
An indication of the forms generally available is also included.
PDF Catalog
| PDF Pages | PDF Title |
|---|---|
| 2 | undefined |
| 7 | Foreword |
| 8 | Introduction |
| 10 | 1 Scope 2 Normative references 3 Terms and definitions 4 Chemical composition 5 Forms of delivery 5.1 General |
| 11 | 5.2 Unit of product 6 Sampling and analysis 7 Marking, labelling and packaging |
| 19 | Annex A (informative) Comparison between alloy numbers in this document and short names and chemical compositions according to IEC 61190-1-3 |
| 22 | Bibliography |
