BS ISO 18116:2005
$142.49
Surface chemical analysis. Guidelines for preparation and mounting of specimens for analysis
| Published By | Publication Date | Number of Pages |
| BSI | 2005 | 26 |
PDF Catalog
| PDF Pages | PDF Title |
|---|---|
| 3 | TitlePage – Surface chemical analysis�— Guidelines for preparation and mounting of specimens for … |
| 5 | TableofContent – Contents Page |
| 7 | Foreword – Foreword |
| 8 | Introduction – Introduction |
| 9 | Scope – 1��� Scope NormativeReference – 2��� Normative references Clause1 – 4��� Symbols and abbreviated terms Clause1 – 5��� General requirements |
| 10 | Clause1 – 6��� Visual inspection of the specimen Clause1 – 7��� Specimen considerations Subclause2 – 7.1��� History Subclause2 – 7.2��� Information sought Subclause2 – 7.3��� Specimens previously examined by other analytical techniques |
| 11 | Clause1 – 8��� Sources of specimen contamination Subclause2 – 8.1��� Tools, gloves, mounts and similar materials Subclause2 – 8.2��� Exposure to gases Subclause2 – 8.3��� Exposure to instrumental vacuum Subclause2 – 8.4��� Exposure to electrons, ions, and X-rays |
| 12 | Subclause2 – 8.5��� Contamination of the analytical chamber Clause1 – 9��� Specimen storage and transfer Subclause2 – 9.1��� Storage time Subclause2 – 9.2��� Storage containers Subclause2 – 9.3��� Temperature and humidity |
| 13 | Subclause2 – 9.4��� Specimen transfer Clause1 – 10��� Specimen mounting procedures Subclause2 – 10.1��� General procedures Subclause2 – 10.2��� Powders and particles |
| 14 | Subclause2 – 10.3��� Wires, fibres and filaments Subclause2 – 10.4��� Pedestal mounting Subclause2 – 10.5��� Reduction of thermal damage during analysis Clause1 – 11��� Methods for reducing specimen charging Subclause2 – 11.1��� General considerations Subclause2 – 11.2��� Conductive mask, grid, wrap or coating |
| 15 | Subclause2 – 11.3��� Flood gun Subclause2 – 11.4��� Electron and ion beams Subclause3 – 11.4.1��� Angle of incidence of the primary beam in AES Subclause3 – 11.4.2��� Energy of the primary beam in AES and SIMS Subclause3 – 11.4.3��� Current density of the primary beam in AES and SIMS Subclause3 – 11.4.4��� Combined electron and ion beams in AES Clause1 – 12��� Specimen preparation techniques Subclause2 – 12.1��� General considerations Subclause2 – 12.2��� Mechanical separation |
| 16 | Subclause2 – 12.3��� Thinning versus removal Subclause2 – 12.4��� Removal of the substrate Subclause2 – 12.5��� Sectioning techniques Subclause3 – 12.5.1��� General information Subclause3 – 12.5.2��� Sectioning methods Subclause3 – 12.5.3��� Angle lapping Subclause3 – 12.5.4��� Ball cratering |
| 17 | Subclause3 – 12.5.5��� Radial sectioning Subclause3 – 12.5.6��� Mechanical polishing Subclause3 – 12.5.7��� Chemical and electrochemical polishing Subclause3 – 12.5.8��� Crater edge profiling Subclause3 – 12.5.9��� Focused ion beam sectioning Subclause2 – 12.6��� Growth of overlayers Subclause2 – 12.7��� Solvents |
| 18 | Subclause2 – 12.8��� Chemical etching Subclause2 – 12.9��� Ion sputtering Subclause3 – 12.9.1��� General information Subclause3 – 12.9.2��� Altered layer Subclause3 – 12.9.3��� Preferential sputtering Subclause3 – 12.9.4��� Chemical changes Subclause3 – 12.9.5��� Sputtering with hydrogen Subclause3 – 12.9.6��� Changes of surface and interface topography |
| 19 | Subclause3 – 12.9.7��� Sputtering and heating Subclause3 – 12.9.8��� Sputter-enhanced diffusion Subclause2 – 12.10��� Plasma etching Subclause2 – 12.11��� Heating Subclause2 – 12.12��� Ultraviolet radiation |
| 20 | Clause1 – 13��� Fracturing, cleaving and scribing Subclause2 – 13.1��� Fracture Subclause3 – 13.1.1��� General information Subclause3 – 13.1.2��� Preparation of specimens Subclause2 – 13.2��� Cleaving Subclause2 – 13.3��� Scribing |
| 21 | Clause1 – 14��� Special specimen-handling techniques Subclause2 – 14.1��� Prepumping of gassy specimens Subclause2 – 14.2��� Viscous liquids Subclause2 – 14.3��� Solute residue |
| 22 | Bibliography – Bibliography |
