BSI DD IEC/PAS 62137-3:2008:2009 Edition

$189.07

Electronics assembly technology. Selection guidance of environmental and endurance test methods for solder joints

Published By	Publication Date	Number of Pages
BSI	2009	46

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Description

IEC/PAS 62137-3:2008(E) describes the selection of an appropriate test method for reliability test of solder joints for various shapes and types of surface mount devices (SMD) and leaded devices, including various types of solder material.

Additional information

Status	Withdrawn
Title	Electronics assembly technology. Selection guidance of environmental and endurance test methods for solder joints
Publisher	BSI
Committee	EPL/501
Pages	46
Publication Date	2009-01-31
Withdrawn Date	2012-03-31
Replaced By	BS EN 62137-3:2012, BS EN 62137:2004
ISBN	978 0 580 64126 8
Standard Number	DD IEC/PAS 62137-3:2008
Identical National Standard Of	IEC/PAS 62137-3:2008
Descriptors	Soldered joints, Life (durability), Electronic equipment and components, Solders, Integrated circuits, Surface mounting devices, Endurance testing, Environmental testing, Thermal testing, Printed-circuit boards, Soldering, Mechanical testing
ICS Codes	31.190 - Electronic component assemblies

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BSI DD IEC/PAS 62137-3:2008

$189.07


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