EIA RS-186-10-E-1978

$20.15

Passive Electronic Component Parts, Test Methods for; Method 10: Effect of Soldering

Published By	Publication Date	Number of Pages
ECIA	1978	4

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Category: ECIA

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Description

PURPOSE

This test is performed to determine the effect of normal
soldering operations on component parts. Excessive changes in
electrical characteristics or mechanical damage to a component part
are often caused by the short-time application of high heat, such
as is applied to integral component terminastions by a soldering
iron or a solder-bath dip in assembly operations. The effect of
soldering test is intended to simulate these manufacturing
conditions and detect faults in component parts which otherwise may
not be noticed until after final equipment assembly.

NOTE 1: (For a test for determining the ability of component
part terminations to accept solder, see EIA Standard RS-178-A,
Solderability Test Standard.)

NOTE 2: (A recommended solder is one in accordance with ASTM
B32, Grade A, having a nominal composition of 60% tin and 40%
lead.)

Additional information