EIA RS-186-9-E-1978

$21.45

Passive Electronic Component Parts, Test Methods for; Method 9: Solderability

Published By	Publication Date	Number of Pages
ECIA	1978	9

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Category: ECIA

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Description

This standard defines a test for solderability of solid lead
wires, terminals, and conductive accessories of component parts
which are to be joined by a soldering operation involving the use
of rosin type flux and solder of the types of covered by QQ-S-571.
The specific times and temperatures are for lead wires not
greater than 0.045 inch (1.14 mm) in diameter. For larger diameter
wires, stranded leads or other parts, the test procedure may be
modified as outlined in Paragraph 10. This standard includes test
conditions which may be selected and referenced as condition 1, or
2 as per Paragraph 7.

PURPOSE

The purpose of this test standard is to determine the
solderability of solid lead wires, terminals, and other
terminations which are normally joined by means of soft solder.

This Standard shall not be construed as a production procedure
for soldering operations.

The solderability determination is made on the bask of the
ability of the terminal of the part to be wetted by a coat of new
solder, to verify that the treatment used in the manufacturing
process to facilitate soldering is satisfactory, and that this
treatment has been applied to the required portion of the part
designed to accommodate a soldered connection.

The applicability of this test standard as to the size of the
terminals tested should he considered before use in the referencing
specification. The solder temperatures and the dwell times given in
this standard are normally limited to component parts with
terminals up to 17AWG wire size or 0.045 inch (1.14mm) in diameter.
Variation in pot temperature, Paragraph 7, and the immersion
procedure, Paragraph 8.2, of the standard will provide for
specifications that include larger type terminals.

Additional information