{"id":385436,"date":"2024-10-20T03:30:43","date_gmt":"2024-10-20T03:30:43","guid":{"rendered":"https:\/\/pdfstandards.shop\/product\/uncategorized\/bs-en-iec-63244-12021\/"},"modified":"2024-10-26T06:22:24","modified_gmt":"2024-10-26T06:22:24","slug":"bs-en-iec-63244-12021","status":"publish","type":"product","link":"https:\/\/pdfstandards.shop\/product\/publishers\/bsi\/bs-en-iec-63244-12021\/","title":{"rendered":"BS EN IEC 63244-1:2021"},"content":{"rendered":"
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2<\/td>\n | undefined <\/td>\n<\/tr>\n | ||||||
5<\/td>\n | Annex ZA (normative)Normative references to international publicationswith their corresponding European publications <\/td>\n<\/tr>\n | ||||||
7<\/td>\n | English CONTENTS <\/td>\n<\/tr>\n | ||||||
9<\/td>\n | FOREWORD <\/td>\n<\/tr>\n | ||||||
11<\/td>\n | INTRODUCTION <\/td>\n<\/tr>\n | ||||||
12<\/td>\n | 1 Scope 2 Normative references <\/td>\n<\/tr>\n | ||||||
13<\/td>\n | 3 Terms, definitions and symbols 3.1 Terms and definitions 3.1.1 General terminology <\/td>\n<\/tr>\n | ||||||
14<\/td>\n | 3.1.2 Terminology for near-field based wireless power transfer <\/td>\n<\/tr>\n | ||||||
15<\/td>\n | 3.1.3 Terminology for far-field based wireless power transfer <\/td>\n<\/tr>\n | ||||||
16<\/td>\n | 3.2 Symbols and abbreviated terms <\/td>\n<\/tr>\n | ||||||
17<\/td>\n | 4 Classification Tables Table 1 \u2013 Letter symbols and abbreviated terms <\/td>\n<\/tr>\n | ||||||
18<\/td>\n | Figures Figure 1 \u2013 Classification of WET technologies Table 2 \u2013 Example of blank specifications: classification of wireless power transfer methods and distance according to products and power consumption <\/td>\n<\/tr>\n | ||||||
19<\/td>\n | 5 Test items for reliability 5.1 General 5.2 IP rating Figure 2 \u2013 Example of reliability test conditions and items <\/td>\n<\/tr>\n | ||||||
20<\/td>\n | 5.3 Temperature test 5.4 Humidity test 5.5 Mechanical impact and vibration test 5.6 EMC test 5.6.1 General 5.6.2 Electromagnetic immunity 5.6.3 Electromagnetic emission <\/td>\n<\/tr>\n | ||||||
21<\/td>\n | 6 Performance evaluation items 6.1 Efficiency 6.1.1 General 6.1.2 Block diagram for efficiency analysis Figure 3 \u2013 Block diagram for efficiency analysis of MF WPT system Figure 4 \u2013 Block diagram for efficiency analysis of EMW WPT system <\/td>\n<\/tr>\n | ||||||
22<\/td>\n | 6.1.3 Component-level efficiency <\/td>\n<\/tr>\n | ||||||
23<\/td>\n | Figure 5 \u2013 Measurement setup for AC to DC convertingefficiency or rectifying efficiency <\/td>\n<\/tr>\n | ||||||
24<\/td>\n | Figure 6 \u2013 Measurement setup for DC to DC converting efficiency <\/td>\n<\/tr>\n | ||||||
25<\/td>\n | 6.1.4 Module-level efficiency Figure 7 \u2013 Measurement setup for DC to AC converting efficiency <\/td>\n<\/tr>\n | ||||||
26<\/td>\n | Figure 8 \u2013 Measurement setup for coupling efficiencybetween transmitting and receiving coils <\/td>\n<\/tr>\n | ||||||
27<\/td>\n | 6.1.5 System-level power transfer efficiency Figure 9 \u2013 Measurement setup for power transfer efficiency between power transmitting and receiving antennas <\/td>\n<\/tr>\n | ||||||
28<\/td>\n | 6.2 Evaluation components in PTx and PRx 6.2.1 General 6.2.2 Rectifier and ripple smoothing circuit Figure 10 \u2013 Semiconductor components in PTx and PRx <\/td>\n<\/tr>\n | ||||||
29<\/td>\n | Table 3 \u2013 Example of blank specifications of a rectifier diode <\/td>\n<\/tr>\n | ||||||
30<\/td>\n | Figure 11 \u2013 Half-wave rectifier and input\/output waveform <\/td>\n<\/tr>\n | ||||||
31<\/td>\n | 6.2.3 DC to DC converter Figure 12 \u2013 Full-wave rectifier and input\/output waveform Figure 13 \u2013 Diode- bridge rectifier and RC smoothing circuits <\/td>\n<\/tr>\n | ||||||
32<\/td>\n | 6.2.4 Inverter Figure 14 \u2013 Example of step down converter (Buck converter)and step up converter (Boost converter) Table 4 \u2013 Example of blank specifications of a step- down DC-to-DC converter <\/td>\n<\/tr>\n | ||||||
33<\/td>\n | Figure 15 \u2013 Example of equivalent circuit and square AC output signal Table 5 \u2013 Example of blank specifications of an inverter used for MF WPT <\/td>\n<\/tr>\n | ||||||
34<\/td>\n | 6.2.5 Variable gain amplifier (VGA) Figure 16 \u2013 Block diagram of VGA <\/td>\n<\/tr>\n | ||||||
35<\/td>\n | Figure 17 \u2013 3 dB bandwidth Figure 18 \u2013 P1dB, MDS and dynamic input range of a variable gain amplifier <\/td>\n<\/tr>\n | ||||||
37<\/td>\n | Annex A (informative)Field regions for electromagnetically short antenna Figure A.1 \u2013 Field regions for electromagnetically short antenna <\/td>\n<\/tr>\n | ||||||
38<\/td>\n | Bibliography <\/td>\n<\/tr>\n<\/table>\n","protected":false},"excerpt":{"rendered":" Semiconductor devices. Semiconductor devices for wireless power transfer and charging – General requirements and specifications<\/b><\/p>\n |