{"id":417112,"date":"2024-10-20T06:14:24","date_gmt":"2024-10-20T06:14:24","guid":{"rendered":"https:\/\/pdfstandards.shop\/product\/uncategorized\/bs-en-62047-182013-2\/"},"modified":"2024-10-26T11:36:22","modified_gmt":"2024-10-26T11:36:22","slug":"bs-en-62047-182013-2","status":"publish","type":"product","link":"https:\/\/pdfstandards.shop\/product\/publishers\/bsi\/bs-en-62047-182013-2\/","title":{"rendered":"BS EN 62047-18:2013"},"content":{"rendered":"
This part of IEC 62047 specifies the method for bend testing of thin film materials with a length and width under 1 mm and a thickness in the range between 0,1 \u00b5m and 10 \u00b5m. Thin films are used as main structural materials for Micro-electromechanical Systems (abbreviated as MEMS in this document) and micromachines.<\/p>\n
The main structural materials for MEMS, micromachines, etc., have special features, such as a few micron meter size, material fabrication by deposition, photolithography, and\/ or non-mechanical machining test piece. This International Standard specifies the bend testing and test piece shape for micro-sized smooth cantilever type test pieces, which enables a guarantee of accuracy corresponding to the special features.<\/p>\n
PDF Pages<\/th>\n | PDF Title<\/th>\n<\/tr>\n | ||||||
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6<\/td>\n | English CONTENTS <\/td>\n<\/tr>\n | ||||||
7<\/td>\n | 1 Scope 2 Normative references <\/td>\n<\/tr>\n | ||||||
8<\/td>\n | 3 Symbols and designations 4 Test piece 4.1 Design of test piece Figures Figure 1 \u2013 Schematically shown test piece with substrate Tables Table 1 \u2013 Symbols and designation of test piece <\/td>\n<\/tr>\n | ||||||
9<\/td>\n | 4.2 Preparation of test piece 4.3 Test piece width and thickness 4.4 Storage prior to testing 5 Testing method 5.1 General <\/td>\n<\/tr>\n | ||||||
10<\/td>\n | Figure 2 \u2013 Measurement method <\/td>\n<\/tr>\n | ||||||
11<\/td>\n | 5.2 Method for mounting of test piece 5.3 Method for loading 5.4 Speed of testing 5.5 Displacement measurement 5.6 Test environment 5.7 Data analysis <\/td>\n<\/tr>\n | ||||||
12<\/td>\n | 6 Test report 5.8 Material for test pieces <\/td>\n<\/tr>\n | ||||||
13<\/td>\n | Annex A (informative) Precautions for the test piece\/substrate interface Figure A.1 \u2013 Finishing angle of substrate contact area with test piece <\/td>\n<\/tr>\n | ||||||
14<\/td>\n | Annex B (informative) Precautions necessary for the force displacement relationship Figure B.1 \u2013 Cantilever type bend test piece of metallic glass in accordance with IEC\u00a062047-18 <\/td>\n<\/tr>\n | ||||||
15<\/td>\n | Figure B.2 \u2013 Typical example of relationship between force and displacement <\/td>\n<\/tr>\n<\/table>\n","protected":false},"excerpt":{"rendered":" Semiconductor devices. Micro-electromechanical devices – Bend testing methods of thin film materials<\/b><\/p>\n |