This part of IEC 62047 specifies the adhesive testing method between micro-sized elements and a substrate using the columnar shape of the specimens. This international standard can be applied to adhesive strength measurement of microstructures, prepared on a substrate, with width and thickness of 1 \u03bcm to 1 mm, respectively.<\/p>\n
Micro-sized elements of MEMS devices are made up of laminated fine pattern films on a substrate, which are fabricated by deposition, plating, and\/or coating with photolithography. MEMS devices include a large number of interfaces between dissimilar materials, at which delamination occasionally occurs during fabrication or in operation. Combination of the materials at the junction determines the adhesive strength; moreover, defects and residual stress in the vicinity of the interface, which are changing by processing condition, strongly affect the adhesive strength. This standard specifies the adhesive testing method for micro-sized-elements in order to optimally select materials and processing conditions for MEMS devices.<\/p>\n
This standard does not particularly restrict test piece material, test piece size and performance of the measuring device, since the materials and size of MEMS device components range widely and testing machine for micro-sized materials has not been generalized.<\/p>\n
| PDF Pages<\/th>\n | PDF Title<\/th>\n<\/tr>\n | ||||||
|---|---|---|---|---|---|---|---|
| 6<\/td>\n | English CONTENTS <\/td>\n<\/tr>\n | ||||||
| 7<\/td>\n | 1 Scope 2 Normative references 3 Terms and definitions <\/td>\n<\/tr>\n | ||||||
| 8<\/td>\n | 4 Test method 4.1 General Figures Figure 1 \u2013 Columnar test pieces <\/td>\n<\/tr>\n | ||||||
| 9<\/td>\n | 4.2 Data analysis Figure 2 \u2013 Adhesive strength test method <\/td>\n<\/tr>\n | ||||||
| 10<\/td>\n | 5 Test equipment 5.1 General 5.2 Actuator 5.3 Force measurement sensor 5.4 Alignment system 5.5 Recorder <\/td>\n<\/tr>\n | ||||||
| 11<\/td>\n | 6 Test pieces 6.1 Design of test pieces 6.2 Preparation of test pieces 7 Test conditions 7.1 Method for gripping 7.2 Speed of testing 7.3 Alignment of test piece <\/td>\n<\/tr>\n | ||||||
| 12<\/td>\n | 7.4 Test environment 8 Test report Figure 3 \u2013 Alignment between columnar test piece and loading tool <\/td>\n<\/tr>\n | ||||||
| 13<\/td>\n | Annex A (informative) Technical background Figure A.1 \u2013 Example of the RRT results (see [1]) <\/td>\n<\/tr>\n | ||||||
| 14<\/td>\n | Figure A.2 \u2013 Effects of aspect ratio of columnar test piece on the stress conditionin bend type test (see [2]) <\/td>\n<\/tr>\n | ||||||
| 15<\/td>\n | Figure A.3 \u2013 Effects of knife edge angle of loading tool and aspect ratioof columnar test piece on the stress condition in bend test <\/td>\n<\/tr>\n | ||||||
| 16<\/td>\n | Bibliography <\/td>\n<\/tr>\n<\/table>\n","protected":false},"excerpt":{"rendered":" Semiconductor devices. Micro-electromechanical devices – Bend-and shear-type test methods of measuring adhesive strength for MEMS structures<\/b><\/p>\n |